Impact of Thermal Aging on the Microstructure Evolution and Mechanical Properties of Lanthanum-Doped Tin-Silver-Copper Lead-Free Solders

摘要

The authors would like to thank Ste´phanie Blanc (Electrical Engineer at Schlumberger) for her useful contribution to the project, Claude Guyomard and Olivier Naegelen (Arts et Me´tiers ParisTech) for the die design and sample casting, respectively, andJean-Marc Raulot for his enriching discussions.